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Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-Sided Flexible Printing Membrane Printed FPC Circuit

  • 강조하다

    double-sided FPC circuit membrane

    ,

    flexible printing membrane switch

    ,

    printed FPC circuit switch

  • 모델 번호.
    HC-FPC-002
  • 조합 모드
    접착성 유연한 플레이트
  • 전도성 접착제
    전도성은 페이스트
  • 난연제
    HB
  • 가공기술
    전해박
  • 기본 재료
    알류미늄
  • 단열재
    유기수지
  • 평균 두께
    1.1-0. 오전
  • 동박 종류
    전해 및 압연
  • 동박 두께
    1온스, 1/2온스, 1/3온스
  • 기판 필름 두께
    100만, 1/200만
  • 커버 필름 두께
    100만, 1/200만
  • 보강재 두께
    3만~9만
  • 생산능력
    100,000pcs/월
  • Hs 코드
    8536500000
  • 최소 주문 수량
    100

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-Sided Flexible Printing Membrane Printed FPC Circuit
Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.
Key Features and Benefits
  • Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
  • Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
  • Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
  • Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
  • Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
  • Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
  • Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties
Material Composition
Copper Foil Substrate:
  • Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
  • Substrate Film: Common thickness of 1mil and 1/2mil
  • Adhesive: Thickness customized to customer requirements
Cover Film Protection:
  • Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
  • Adhesive: Thickness customized to customer requirements
  • Prevents adhesive buildup and foreign matter before pressing
Stiffener (PI Stiffener Film):
  • Reinforces mechanical strength for surface mounting
  • Common thickness: 3mil to 9mil
  • Adhesive: Thickness customized to customer requirements
EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.
Competitive Advantages
  • Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
  • Compact Size: Small volume PCB effectively reduces product dimensions
  • Lightweight: Significantly lighter than traditional rigid PCBs
  • Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
  • Quick Delivery
  • Premium Services
  • OEM/ODM Customization Available
Application Images
Double-Sided Flexible Printing Membrane Printed FPC Circuit 0 Double-Sided Flexible Printing Membrane Printed FPC Circuit 1 Double-Sided Flexible Printing Membrane Printed FPC Circuit 2 Double-Sided Flexible Printing Membrane Printed FPC Circuit 3 Double-Sided Flexible Printing Membrane Printed FPC Circuit 4